Scheffel Boyle is one of several local businesses joining together for the highly anticipated “Gigabit Challenge” in Highland, Illinois.
The firm is supporting the business plan competition, which boasts more than $50,000 in cash and prizes to the winning teams.
The City of Highland and the Metro East Small Business Development Center have teamed up in the planning of this nationally-publicized professional competition. To be considered, applicants must have their business located in Highland’s city limits and submit a detailed business plan. The winners will be those who best use technology to enhance a product or service.
According to Lisa Peck, Highland’s Economic Development and Marketing Coordinator, the purpose of the competition is to bring new jobs to the Highland community, while furthering “the development of Highland as a technology hub.”
Mark Korte, Scheffel Boyle’s Principal of the Highland office, wanted to be a part of the competition to drive more business and recognition to the local community.
“This is a unique contest that not only encourages forward thinking in a business model, but also focuses on community development for Highland, which is very important to us at Scheffel Boyle,” Korte said. “I look forward to meeting with the winners and discovering how we can help their business succeed in the local community.”
The Highland Gigabit Challenge is sponsored by the city of Highland, Metro East Small Business Development Center, Singleton Law Firm PC, St. Louis Regional Chamber, Highland Chamber of Commerce, Corning, Foppe Visual Communications, Scheffel Boyle, Terra Properties, Bluebird Network, TheBANK of Edwardsville, RETKO Group, Leadership Council Southwestern Illinois, Oates Associates, National Telco Television Consortium, First Clover Leaf Bank, the Rotary Club of Highland, Highland Communication Services, Highland Entrepreneurship Program and Moran Economic Development.
Twelve semifinalists were recently announced for the competition, and winners will be revealed on December 12th, 2014.